3D NAND Memory Market - Industry Analysis, Size, Share, Growth,COVID-19 Impact Analysis, Trends and Forecast - 2025
As per the analysis by Market Research
Future Reports (MRFR), the global 3d
Nand Memory Market was
initially valued at USD 10.56 Billion in 2018 and is estimated to attain USD 62
billion by the end of the review period with a CAGR of 30%.
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The demand for data storage in consumer
electronics and enterprise storage sectors has resulted in the expansion of the
global 3D NAND memory market 2020. Moreover, demand for making chips smaller in
size and semiconductor wafer has also motivated the producing expense incurred
in the design and advancement of 3D NAND memory may act as an obstruction in
the growth of the global 3D NAND market. Additionally, the producers of 3D NAND
memory chips may face some hurdles in the forthcoming period due to the development
in technologies such as 3D XPoint (used in today’s era), solid-state storage
(SSS), resistive random access memory (RRAM), and phase-change memory (PCM).
The organizations
functioning in the 3D NAND memory market pays attention to the advancement of reliable
designs, and they generally compete based on cost, technology, product quality
in the 3D NAND market. The implementation of 3D NAND in various enterprises,
logistics applications, transportation has motivated the manufacturers to stay
updated and ahead with the techniques, and offer its consumers with advanced
flash memory solutions.
Market
Segmentation
The
global 3D NAND memory market has been classified into the application,
vertical, type, and region.
On
the basis of application, the global 3D NAND memory market has been classified
into the flash card, SSD, USB, tablet, smartphone, kiosk, and others.
On
the basis of vertical, the global 3D NAND memory market has been classified
into IT & Telecommunication, transportation, aerospace & defense,
retail, healthcare, and others.
On
the basis of type, the global 3D NAND memory market has been classified into a
triple-level cell (TLC), multi-level cell (MLC), and quad-level cell (QLC).
On
the basis of region, the global 3D NAND memory market has been classified into
Asia-Pacific, North America, the Middle East & Africa, Europe, and Central
& South America.
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Regional
Analysis
The global market for
3D NAND memory is likely to expand tremendously during the forecast period from
2019 to 2025. As per the analysis, the geographic study of the 3D NAND memory
market has been performed for Europe, Asia Pacific, North America, the Middle
East & Africa, and Central and South America.
According to the
research, the APAC region is expected to lead the global 3D NAND memory market.
The second position is attained by North America, followed by Europe and the
Rest of the World (RoW). The rising demand for lightweight memory chips and
durable, to a great extent, in enterprise storage and automotive applications
have motivated the adoption of 3D NAND memory in the region. Additionally, the
existence of semiconductor producing facilities in China has resulted in the
expansion of the global 3D NAND memory market.
Key
Players
The forefront players in the global 3D NAND
memory market are Delkin Devices (US)., Toshiba Corporation (Japan), SAMSUNG (South Korea),
Western Digital Corporation (US), Intel Corporation (US), Micron Technology,
Inc. (the US), SK HYNIX INC. (South Korea), Macronix International Co., Ltd
(Taiwan), Applied Materials, Inc. (US), Yangtze Memory Technologies Co., Ltd
(YMTC) (China). Delkin Devices (US). These enterprises are studied based on
their regional presence, product portfolio, origin, key developments, and
proficiency in the 3D NAND memory solutions. Apart from the organization mentioned
above, Panasonic Corporation (Japan), Transcend Information, Inc. (the US),
Cypress Semiconductor Corporation (US), Hitachi High-Technologies Corporation
(Japan), and also have a significant presence in the global 3D NAND memory
market.
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Research Future:
Market Research Future (MRFR) is
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domains. Our teams of research analysts gather relevant data through
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